Important Information for Proposers

A revised version of the NSF Proposal & Award Policies & Procedures Guide (PAPPG) (NSF 22-1), is effective for proposals submitted, or due, on or after October 4, 2021. Please be advised that, depending on the specified due date, the guidelines contained in NSF 22-1 may apply to proposals submitted in response to this funding opportunity.

New Partnership with the Semiconductor Research Corporation (SRC)

May 20, 2022

The Semiconductor Research Corporation (SRC) and NSF's REU Sites program have launched a partnership to expand undergraduate research opportunities related to advancements in semiconductors. The partnership will foster the development of a diverse science and engineering workforce skilled in an area of high national priority. Proposals for REU Sites that involve research that advances semiconductors may be supported as part of this partnership and may come from NSF's Directorate for Engineering, Division of Materials Research, Division of Physics, or Division of Chemistry. Research involving the monolithic and heterogenous integration of 3D integrated devices and circuits is of special interest. Areas of technical interest include, but are not limited to, materials, devices, circuits, wafer fabrication processes and techniques, packaging materials and processes, thermal management and modeling, and integrated photonics, design, and testing. Also relevant are the critical systems and technology themes described in SRC's JUMP 2.0 solicitation. A proposer to the NSF REU Sites program does not need to take any additional steps to be considered for co-funding through this partnership. Investigators who are interested in the opportunity may e-mail with any questions.